Cold sintered LiMgPO 4 based composites for low temperature co‐fired ceramic (LTCC) applications

Technology and applications of Low Temperature Cofired Ceramic (LTCC) based sensors and microsystems

The paper presents general information on LTCC materials, manufacturing processes and properties of fired modules. A Multichip Module package has been the main application of Low Temperature Cofired Ceramic (LTCC) technology. Recently, this technology is also used for production of sensors, actuators and microsystems. The research and development on the LTCC sensors and microsystems carried out...

Fine structuration of low-temperature co-fired ceramic (LTCC) microreactors.

The development of microreactors that operate under harsh conditions is always of great interest for many applications. Here we present a microfabrication process based on low-temperature co-fired ceramic (LTCC) technology for producing microreactors which are able to perform chemical processes at elevated temperature (>400 °C) and against concentrated harsh chemicals such as sodium hydroxide, ...

Phase and Microstructural Correlation of Spark Plasma Sintered HfB2-ZrB2 Based Ultra-High Temperature Ceramic Composites

Abstract: The refractory diborides (HfB2 and ZrB2) are considered as promising ultra-high temperature ceramic (UHTCs) where low damage tolerance limits their application for the thermal protection system in re-entry vehicles. In this regard, SiC and CNT have been synergistically added as the sintering aids and toughening agents in the spark plasma sintered (SPS) HfB2-ZrB2 system. Herein, a nove...

Investigation of High-Q Resonators Embedded in Low Temperature Cofired Ceramic for Millimetre-Wave Oscillators

Integrated Microfluidic Devices Based on Low-Temperature Co- Fired Ceramic (LTCC) Technology

This paper reviews recent developments in integrated fluidic mesosystems, based on low-temperature co-fired ceramic (LTCC) technology, in this laboratory and elsewhere. LTCC is shown to be an advantageous technique for integrated fluidic systems, due to its simplicity, low cost and ease of integration with other technologies and components (silicon, polymer, circuit boards. Also, the techniques...